Online scholarships

OCI Thermal Engineering Intern

Internship Role intended for current students pursuing their Bachelor’s/Masters degree and having completed their junior year by Summer 2025. This position is located in Burlington, MA.  The Oracle Hardware Development (OHD) organization in Burlington, MA is looking for a Thermal Mechanical intern to work with our mechanical and thermal design team to support all phases of our development life-cycle, including design, simulation, documentation, and testing/validating prototype thermal designs and measuring airflow in our HW lab.